Electronics Forum | Wed Oct 01 10:01:15 EDT 2008 | davef
We've never used the 99*C lead-free solder you mention. We have used a leaded solder that can form a 93*C eutectic solder. So, we had to be sure the service temperature [of the solder connections] as below 80*C.
Electronics Forum | Wed Mar 21 10:44:26 EST 2001 | raton
Could they have meant eutectic?
Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken
What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n
Electronics Forum | Wed Sep 10 17:21:08 EDT 2008 | gregoryyork
Strange we use the 179~C eutectic 62/36/2 solder paste as standard in Europe. It is indeed 2% Ag in fact we dont sell 63/37 paste or very rarely. I think if you mix a little 60/40 powder with the 2% Ag alloy this overcomes the tombstoning problem.
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Sat Nov 21 12:22:00 EST 2009 | patrickbruneel
You are technically correct eutectic Sn/Pb was discovered by the ancient Egyptians in (XXX) BC much longer then 20 centuries. I was just referring to soft soldering in the electronics assembly industry :-).
Electronics Forum | Wed Sep 10 17:08:08 EDT 2008 | slthomas
Isn't that the non-eutectic one that provides the pasty phase range that people use to clobber their tombstoning problems?
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Tue Jun 06 14:31:42 EDT 2000 | Jeff Sanchez
I have 25#'s of bismuth in my shop. I wanted to add some to my 63/37 till it was eutectic. This would allow me to lower the waves temp. Can I do this and still meet standards? Also would it make the solder joints to brittle and would discoloration be
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
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