Electronics Forum | Wed Feb 15 21:49:40 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM
Electronics Forum | Wed Feb 15 21:54:07 EST 2006 | Jose Luis Mendoza
Hi there,, Im looking for information about history and evolution of the PIH process. I will use this information for the state-of-the -art in my Master.D tesis project. Any information will be appreciate! Regards. Jos� Luis Mendoza ITESM jlmen
Electronics Forum | Tue Jul 05 16:14:06 EDT 2011 | blnorman
Is this an addition-cure silicone? We once had coating bubbling caused by the evolution of the solvent in the paste flux under leadless components.
Electronics Forum | Tue Jul 21 14:22:58 EDT 2020 | emeto
As part of the evolution, electronic feeder has a lot of advantages - precision, programming and speed. If you build low volume easy boards you can probably stick with the mechanical feeders. For challenge and volume, I would suggest you move on to t
Electronics Forum | Fri Feb 17 09:08:22 EST 2017 | davef
An interesting paper on the topic is "The evolution of surface finishes in mobile phone applications" by Claus Würtz Nielsen at Nokia Mobile Phones R&D [http://www.cicmt.org/adv_micro/papers/Nordic2004paper.pdf] The paper reported corrosion problem
Electronics Forum | Fri Jan 24 19:49:40 EST 2003 | jonfox
QSA series was a joint project, but Quad machines still use feeders made by Samsung, or Samsung makes the feeders Quad designed (whatever). QSoft has two different evolutions, Qsoft(1) went to Samsung, and Qsoft(2) stayed with Quad. I'm sure they h
Electronics Forum | Wed Sep 03 18:20:00 EDT 2003 | davef
Major advance: Productionization of SMT. Minor advances: * Realization and control of solder paste characteristics * Vision alignment controls in printers. * Evolution from mechanical centering [through laser alignment controls] to vision alignment
Electronics Forum | Wed Jan 12 09:33:27 EST 2005 | fasst1
Grant, I just have one question. Why would you go from a Mydata machine to a Fuji XP? You seem to be sacrificing component range for raw chip output. Wouldn't one of the multi-function machines (0201 - 45mm with similar speed) on the marketplace
Electronics Forum | Thu Jul 24 22:58:13 EDT 2008 | davef
At the 2004 IMAPS Nordic Conference, Claus W�rtz Nielsson from Nokia Mobile Phones published "The Evolution of Surface Finishes in Mobile Phone Applications" [www.imaps.org/adv_micro/papers/Nordic2004paper.pdf]. Some of the results were: * Corrosion
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
