Electronics Forum | Thu Nov 30 17:49:52 EST 2000 | JAX
Chuck, The smaller the pitch, the more package preferences will lean towards Trays. I would tape everything down to .025", maybe .020". With tape and reel you have fewer chances to place wrong polarity due to excessive part changes. Also part pick
Electronics Forum | Fri May 29 08:22:09 EDT 2009 | scottp
It would help to see pictures, but I suspect the parts are seeing excessive strain when snapped into or removed from the pallet.
Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Mon Jul 12 20:26:10 EDT 2021 | stephendo
A test that I would like to see is, expose parts for 24 hours 40%-60% RH, 25C for 24 hours. Then seal with a HIC and minimum desiccant that Jstd 33 requires. Five to seven days later open and see if HIC says good but parts have excess moisture. I t
Electronics Forum | Tue Oct 12 16:38:24 EDT 1999 | Charlie
At present the band-aid fix is using epoxy 'dam' under the part and masking over the part to pervent excessive current leakage conmonent failure. These parts are first going through the reflow oven, where the epoxy dam is used to over come the leakag
Electronics Forum | Tue Jun 10 14:04:08 EDT 2014 | rway
Perhaps neither. I assume the part is T&R. It's flipping inside the tape before placement. I don't know how the nozzle could be doing it. There could be excess vibration on the feeder which is causing the part to flip. Just a thought.
Electronics Forum | Wed Dec 28 16:49:26 EST 2022 | emeto
HiP most of the time goes back to the component package itself. If they are on the periphery of the part, it is a result excessive of expansion and contraction from the temperature. If it is in the middle, other contributors come in place.
Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax
Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility
Electronics Forum | Mon Jun 29 10:19:25 EDT 2009 | brandieatborisch
Are there any photos available of what good HASL finish looks like as opposed to not desired? I'm looking for something to use as an aide in inspection becasue sometimes boards at our facility are received with HASL where the solder is excessive cau
Electronics Forum | Wed Aug 14 17:36:19 EDT 2013 | rgduval
I always prefer to not count parts, period. Generally, I don't have too many problems with customers with this method....I explain to them that the cost of my counting the parts (to them) is much more expensive than the cost of them supplying excess
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