Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Thu Oct 30 18:10:19 EDT 2014 | hegemon
Rather than asking why, maybe the better response is to reject the PWBs and have them re-fabricated correctly? Of course circular reasoning tells me that the reason for your issues is that you have 3x the amount of nickel beneath the gold. I wish I
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Wed Aug 04 15:27:03 EDT 2004 | Rush Fan
I might suggest that you check with your solder paste manufacturer to see what is recommended for time over reflow. Typically, I think most are between 60 and 90 seconds over 183. Also, consider the rate of cooling. The faster you cool the solder, th
Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli
Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of
Electronics Forum | Wed Mar 28 13:14:38 EDT 2007 | amelara98
I am having problems with a product we receive from our overseas plant, where there is excessive "dullness" of solder joints/metal surfaces after running a board on a pallet through wave solder. Seems to be an issue of the pallet, as the solder appe
Electronics Forum | Thu Nov 14 03:12:42 EST 2019 | jefri_simorangkir
hi Team, observed excess solder after assembly jumper with manual solder method. I already try to duplicate the phenomenon with adding more solder tin/wire,adding more time for solder but not found same condition I have attached the image for the
Electronics Forum | Fri Jul 08 08:34:24 EDT 2011 | davef
How did you determine that your thermal recipe "seems to be nailed in"?
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