Electronics Forum: expensing components (Page 1 of 31)

Recycling components

Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen

I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen

assembly with/without TH components

Electronics Forum | Wed Jan 10 04:33:05 EST 2018 | spoiltforchoice

Simulating with what? In developed countries manual labour is expensive but is also still the most common solution to fitting though hole parts, even if the board are then wave-soldered. Mixing SMT and THT on what sounds like a very simple product wi

Reparing 0201 components on PCB-boards

Electronics Forum | Mon Nov 12 16:11:59 EST 2001 | davef

Listen. Reworking 0201 is too expensive. Here�s watt yado � * Cut the lil� suka between the pads on the board using side cutters. * Flick each piece from its pad, after melting the solder with a standard soldering iron. * Solder the terminations

Paste printing fine pitch components

Electronics Forum | Tue Oct 22 09:20:31 EDT 2013 | swag

Yes, car rims (and brass tubas)! You finally helped me get to the bottom of this expensive issue. We fired the culprit. It's the same guy that was using the ultrasonic stencil washer to clean car parts on night shift. It might be snake oil, I don

Re: Gold plated components - solderability issue

Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon

| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: Pb-Free solder alloying with finish on components

Electronics Forum | Tue Aug 22 11:17:04 EDT 2000 | Dr. Ning-Cheng Lee

The classic dilemma, cost vs. performance. In typical applications, Sn whisker growth is not an issue. It only seems to occur under extreme use (high stress, low temperature)conditions. Until this issue is fully addressed, Pd seems to be the favor

Cleaning machine of rejected parts or misfed components?

Electronics Forum | Mon Jan 23 08:15:33 EST 2006 | pavel_murtishev

Good day, Vibratory (MultiStick) feeder is bottleneck of any placement machine. If you feed expensive IC�s via vibratory feeder they surely will be damaged. If you really care about expensive IC�s equip you placement machine with reject conveyor. In

how to calculate smt cost/shot , pls advise me

Electronics Forum | Fri Mar 23 07:34:11 EDT 2007 | davef

Cost per placement = [Equipment cost/5 years/components placed per year] + [Working capital/ components placed per year] + [Expenses/components placed per year]

Silly Attrition Levels

Electronics Forum | Mon Apr 28 13:50:29 EDT 2003 | swagner

We have retaped the components ourselves or had a tape house do it for us and we have on the more expensive components hand placed them in a couple of instances, this is not a common solution and only should be done as a damage control procedure.

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