Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Wed Sep 30 15:27:26 EDT 1998 | Matthew Park
Very simple, you just buy a commerical-grade vacuum sealer. It's not that expensive. A small tabletop unit cost $2000 - $4000. I don't have a number handy. E-mail me off-line if you require more info. Regards Matthew NII, Norsat Internationa
Electronics Forum | Thu Oct 01 20:11:31 EDT 1998 | Wayne Bracy
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Feb 20 08:57:13 EST 2008 | tonyamenson
We test for board cleanliness using an ionic tester. It's been my experience that if your board is clean you take away the possibility of growth even if the unit encounters moisture. We actaully had a problem where our wash lost pressure due to a mi
Electronics Forum | Mon Jun 16 17:13:24 EDT 2003 | fmonette
John, Maybe you know this already but I just wanted to highlight a few facts about dry cabinets. My experience is that many engineers are not well aware of the industry guidelines and sometimes will buy a dry cabinet without understanding the key f
Electronics Forum | Thu Jul 04 00:18:10 EDT 2002 | ianchan
Hi mate, in humble opinion, Hot air Convection types are here to stay. Some machine designer folks are combining IR and Hot Air Relow into integrated technological units for commercial sale to folks like us. Dave F tells us that another group of d
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F
| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th
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