Electronics Forum: fab (Page 10 of 77)

defects in pcb manufacturing

Electronics Forum | Sun Nov 01 01:33:52 EST 2009 | isd_jwendell

Just my opinion: Top pic - Solder mask registration WAY too far off, without a doubt I would reject. Bottom pic - I would worry that there was/is a contamination that caused the poor looking mask. This may be cosmetic only, but unknown. I would rej

Kester 2331-zx flux streaking solder mask

Electronics Forum | Tue Nov 09 20:52:34 EST 2010 | ppcbs

Yes, we have had this happen with certain solder masks over the years. Hot air gun is the best solution we can find if the oven doesn't do it. Back in the day when we had a vapor degreasor, freon based solvents would also remove the clouding. Let

PCB board house manufacturers NORTHEAST

Electronics Forum | Wed Dec 15 10:07:15 EST 2010 | rgduval

We provide PCB fabrication services, as well as contract assembly. Though, we source the PCB fab. If you're more interested in straight PCB fab houses....check out Vermont Circuits or Elektropak (VT Circuits is in Brattleboro, VT; Elektropak is in

Post Reflow changes To Silver Immersion Copper Traces On PWB

Electronics Forum | Mon Feb 18 09:25:20 EST 2019 | davef

It doesn't matter if the traces have solder or not. We're talking thermal cycles. RE IAg thickness: I believe the IAg is a self limiting process, similar to IAu. Your fab may be able to help a little, but I don't expect a substantial change. And if

Soldermask color relating to thickness

Electronics Forum | Fri Nov 22 16:19:45 EST 2019 | davef

I'd guess ... + Pads have no solder mask, clear or otherwise. + Pads won't take solder, because you're trying to solder to nickel. + Nickel on the pads is oxidized and is sticking out its tongue at the flux you're using. + Something went south

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Re: Nodules in barrel plating

Electronics Forum | Mon Sep 11 20:33:25 EDT 2000 | Dave F

What does a section of the through hole look like? Is you fab using a dull drill and plating over the fibers? Good luck

Re: Digitizer help

Electronics Forum | Tue Jul 25 16:27:26 EDT 2000 | Mark Charlton

A former associate was quite pleased with product called ScanCad. If you e-mail me here at SMTnet, I'll get you in touch with him. I believe you could scan a bare pcb fab and extract centroids. Mark

Re: PASTE LEACHING

Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca

Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes

Need Expert Support

Electronics Forum | Wed Mar 14 10:02:36 EST 2001 | blair

Boards were not immersion gold. They were HASL but I would like to change. What is the prefered surface fininsh for BGA and fine pitch stuff these days? I am starting to ask for Gold/Nickel on FAB Dwgs due to PCB house and assy house discussions.


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