Electronics Forum: fab note for enig (Page 1 of 1)

ENIG Thickness for Flex

Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef

Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon

| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F

| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 08:05:23 EST 2000 | Pat Pepper

Hi Dave, Thank you for the response. In answer to your responses I'll use the original numbers of my questions. 1. We would like to turn around our boards fast, but sometimes due to the market conditions we wind up with inventory. After reading

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef

Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Re: Gold Immersion - Soft Joints

Electronics Forum | Tue Oct 26 13:53:16 EDT 1999 | Dave F

William: In answer to your questions: 1 "What do I do about a gold porosity problem?" Get it fixed, before you go out of business!!! You�ve been yapping about it on the internet for three days now!!! Get a more on!!! I don�t understand your com

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