Electronics Forum: fabrics (Page 14 of 85)

Immersion Silver Reliability

Electronics Forum | Tue Apr 20 20:09:30 EDT 2004 | davef

Companies that license immersion silver technology to board fabricators are: * Alpha Level Silver * Mac Dermid Sterling [Mac Dermid's TM]

PCB & Ceramic Cap strain - Specification?

Electronics Forum | Mon May 10 17:33:13 EDT 2004 | davef

Oh, OK. There is not specification for that either. Capacitor fabricators [eg, TDK, Kemet, AVX, etc] give good guidelines. For instance: http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/F2111/$file/F2111.pdf

PCB material Nelco13 and FR4

Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef

Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.

Metal Sheet

Electronics Forum | Thu Aug 05 11:47:10 EDT 2004 | Andrew

What are the preferred material for metal sheet?What can be done to prevent oxidation?What are the process available at Metal Sheet fabrication company?

Generating Gerber File

Electronics Forum | Fri Apr 15 16:06:09 EDT 2005 | davef

Kinda makes you wonder if the product truly belongs to your customer, doesn't it? There should be a marking or legend on the bare board that identifies the board fabricator. That fab should have artwork / gerber data for the board.

TH Crystals

Electronics Forum | Tue May 10 08:23:07 EDT 2005 | davef

We wave [primary side] and reflow crystals for oscillators without fear. We hand solder liquid crystal displays. Consider checking with the crystal fabricator and using their guidelines.

Peelable Masking

Electronics Forum | Tue May 10 17:50:08 EDT 2005 | davef

Consider: * Changing your temporary solder resist [TSR] to a light cure. * Contracting with your board fabricator to apply the TSR. * Gaining better thickness control of your application process by silk screening the current TSR. * Forcing more air c

Solder Wetting Problems, Need Referee's

Electronics Forum | Tue May 31 10:58:31 EDT 2005 | davef

There are a host of possibilities. Virtually any fabrication process prior to outer layer manufacturing prior to HAL could contribute to dewetting. That goes all the way to excessive brighteners in the copper plating line. Anything that prevents the

IPC 4104/21 MATERIAL

Electronics Forum | Thu Jun 09 21:45:23 EDT 2005 | davef

We don't know, but we'd contact Enthone-OMI [ http://www.enthone-omi.com ] for suggestions. Enthone makes materials used by fabricators of HDI, microvia boards.

Maximum Overprint

Electronics Forum | Tue Jun 28 21:54:44 EDT 2005 | davef

Fabricators take different approaches in developing paste that is more or less prone to solder balling. That being said, you should be able to overprint 250 thou, no problem. Prove this to be correct by printing paste on a scrap board with an obsol


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