Electronics Forum: fabrics (Page 16 of 85)

Void on soldering

Electronics Forum | Thu Jul 26 22:52:56 EDT 2007 | davef

Choices are: * Respin the board to move the via so that it is no longer under the pad. * Have the board fabricator plug and plate over the via. Search the fine SMTnet Archives for background.

PC Board Guidelines

Electronics Forum | Thu Sep 20 16:06:23 EDT 2007 | jmelson

Are these shorts occuring after reflow, or are they shorted on the incoming boards before stuffing? If the latter, is the fabricator doing electrical test? How are these boards getting past their electrical test? Especially if multilayer, there's

Ekra Stencil Printer

Electronics Forum | Tue Jun 03 20:07:17 EDT 2008 | fastek

"Thats why i love this site its good for information and offers updated information to everyone" As long as the information isn't a fabrication, I would agree with you. Folungwin has installed no more than 5 printers in the US........and likely the

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef

Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse

Looking for a SMT terminal feeder manufacturer

Electronics Forum | Thu Oct 02 10:43:37 EDT 2008 | msangabriel

I am looking for companies that fabricates special or custom SMT feeders for an Fuji IP3 machine. It is to feed a SMT terminal. Do you know of any company that you can recommend?

SMT Connector, Placement Issues

Electronics Forum | Mon Oct 06 15:17:12 EDT 2008 | davef

Q1: You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? A1: We're not even considering the accuracy of your placement machine. We base our comments on the gap between the hole and the connec

OSP & Presoldering

Electronics Forum | Mon Oct 27 23:25:56 EDT 2008 | davef

Each thermal cycle decreases the thickness of the OSP. So depending on the material, fabrication method, and blablabla; after one thermal cycle we'd expect the OSP to provide adequate protection for a couple of days. After that, you may need a more a

Lead Free finish

Electronics Forum | Mon Nov 03 14:50:08 EST 2008 | dphilbrick

One other note, NEVER have an ENIG board fabricated by a house that "farms out" the gold. This always ends in disaster! Make sure whoever you choose does the whole process.

Building RF Power Transistors Test fixtures

Electronics Forum | Wed Dec 10 21:40:06 EST 2008 | davef

So, this fine designer thinks the cost of you putzing around with is thing is cheaper to the comapny? No. The fine designer is measured on in-bound cost, but not on the impact on overhead of those in-bound costs. OK, try this one: Have your fabric

Any good soldering pallets fabricators to recommend??

Electronics Forum | Thu Feb 05 09:02:26 EST 2009 | mefloump

We use Ascentec Engineering and have used DMI and Pentagon. All make a very good product. I have no association with the business mentioned above.


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