Electronics Forum | Wed Apr 07 10:35:28 EDT 2021 | micropak
What problem you are facing with F5 ?
Electronics Forum | Thu Feb 08 16:39:18 EST 2024 | dharmendra
You face this types issue before.
Electronics Forum | Thu Jul 20 12:11:28 EDT 2000 | Mike McMonagle
There are many challenges facing the assembly industry today such as: - Lead-free assembly and other environmental concerns - Continued shrinkage of active and discrete components - �New� alternate fab finishes such as immersion tin and silver - The
Electronics Forum | Thu Jan 09 06:44:38 EST 2003 | ldzaugis
One shop picked up productivity with walkmen. The hand assemblers were jammed in tight and frequently face to face. It cut down conversation significantly and reduced complaints about music in general. The policy was eventually changed to only one he
Electronics Forum | Fri Jul 30 00:21:01 EDT 2004 | Jet
Hi, Very interesting article on tombstone issue, i'm facing tombstone issue for 0805 IDC component, i've redesign the stencil aperture and change to lead free paste, the tombstone is reducing but not fully eliminated, however there is a problem i fa
Electronics Forum | Thu Jul 05 15:13:46 EDT 2007 | joeherz
We've seen non-functional QFNs cured by touching up the toe fillets. Especially with parts that are not plated on the edge/face where you get minimal/no wetting due to oxidation of bare copper. I'm not suggesting that you touch everything up but th
Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN
We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d
Electronics Forum | Fri Aug 04 06:43:40 EDT 2017 | kubabel
Dear all, I´d like to ask You, if somebody faced similar situation like we are facing in our plant right now. We have wetting problems with some of our products. During SEM/EDX we found on non-wetted parts residues of Mineral oil - white - heavy. Do
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Fri May 24 07:53:13 EDT 2024 | davidk
In our company we are facing the problem at our SMT line with component: relay panasonic TX2SA-5V.... Very frequently there are missing or lifted components(chips or small SOT) nearby of theses relays after reflow. Did someone faced to simmilar issue
