Electronics Forum | Tue Feb 06 23:01:44 EST 2007 | Wayne
The QFN is found to have contact problem during FCT. The paste that I am currently using is SnPb 63/37 water soluble paste. Is it because of water soluble paste? (unable to clean after reflow process as QFN is entrapped by paste/flux) Should we use
Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl
Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer
Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
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