Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Mon Jul 26 10:25:12 EDT 1999 | Boca
| | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that a
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
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