Electronics Forum | Fri Apr 30 10:50:24 EDT 2010 | dldavis
Where do I find data which shows how much dwell time is excessive in a solder fountain when install through hole connectors into a polyimide board.
Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell
A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad
Electronics Forum | Mon May 03 10:52:18 EDT 2010 | davef
We're not sure that such data is available. What guidelines does your flux supplier provide in soldering with this process?
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Thu Jul 29 09:00:56 EDT 2004 | Bryan Sherh
Some short happens between the balls of CPU socket in my site.we decrease the reflow time from about 90sec to 50 sec and decreased the fail rate of short.but x-ray shows balls from part of the Ball array deformed....we can't further decrease the time
Electronics Forum | Wed Aug 04 15:27:03 EDT 2004 | Rush Fan
I might suggest that you check with your solder paste manufacturer to see what is recommended for time over reflow. Typically, I think most are between 60 and 90 seconds over 183. Also, consider the rate of cooling. The faster you cool the solder, th
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
Electronics Forum | Mon Feb 14 14:46:42 EST 2005 | russ
We use Samsung and our 24mm feeders have 8,12,16,and 20mm pitch settings. I have found 20mm pitch quite common. My favorite is yhe 12 on 12 our feeders don't support that, we have to put them up on 16mm feeders our cycle them 3 times on a 4mm pitch
Electronics Forum | Mon Feb 14 13:25:52 EST 2005 | gregp
EIA-481 standard allows the maximum pitch on tape to be 4mm less than the tape width (12mm width and larger). So it is within the standard allowances. As for how common 20mm pitch on 24mm tape is I can not say. I am surprised a 24mm tape feeder ca
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