Electronics Forum | Tue Jul 17 11:15:05 EDT 2007 | allgood
We keep seeing a problem with the plastic tool tip on an A12 tool being sliced off. I think it is hitting the edge of the tape separator clip assembly - I determined this by coating the tip in paint and then finding where the tip had struck the meta
Electronics Forum | Thu Apr 10 05:25:43 EDT 2003 | dst
Hi, My company is currently experiencing a high feild failure rate on a 100nF chip ceramic that we use in various applications across our product range. One of them being de-coupling which means we use millions of this device every month. The failu
Electronics Forum | Fri Nov 07 18:12:50 EST 2014 | cot628
This issue is coming from a customer. The customer demands that we do not mechanically center or test passive components, because of issues they had in the past. There has been a studies that it takes about 8-10 newtons to damage chip. Most of our pa
Electronics Forum | Fri Apr 30 13:26:10 EDT 2021 | amaliahx
The pandemic has altered people's habits, causing a surge in demand for home electronic devices. This has swept the global chip supply and disrupted automobile manufacturing. The pandemic has led to the global shortage of semiconductors or chips, and
Electronics Forum | Mon Mar 03 07:15:24 EST 2014 | JB
Thanks for the reply, how do people handle different packages then if you can't add new ones? If we had a 1206 sized inductor, then a 1206 sized ferrite bead and so on, they would all have to be grouped under the same generic heading? e.g. Chip-R321
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Mon Dec 03 15:46:16 EST 2012 | bmario
Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?
Electronics Forum | Thu Dec 06 15:27:36 EST 2012 | bmario
The package is flip chip BGA (FCBGA592) I found some info on leadless devices damages in IPC610 but it is not exactly what I am looking for.
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Tue Oct 11 12:56:27 EDT 2005 | stepheniii
And consider the posibility that they are actually suffering from MSD type damage.
