Electronics Forum: fifo and system (Page 8 of 39)

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 17:27:07 EST 2003 | msivigny

Hello Dave, I can understand why you might not use the auto-correct function based on the time it takes to perform the operation. I question why there is an auto-correct function in the first place? If I understand the way this works correctly, the m

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny

Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

Pad and Stencil Design

Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake

A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed

PCB Identification and Tracking

Electronics Forum | Tue May 06 09:38:41 EDT 2003 | blnorman

We use both labels and lasers to mark our boards. Since implementing the lasers, the downtime attributed to bar code labels on those lines have dropped to virtually nothing. We still have problems with the labels wrinkling during reflow making read

Pre- and post-reflow rework

Electronics Forum | Fri Feb 11 19:07:16 EST 2005 | primus

We are also looking for AOI machines, pre- and post-reflow. We already tried one machine from the UK (I don't remember the name, I perfer to forget we ever had it) and they told is it would do everything we wanted. Maybe so, but not well enough. It s

SMT optimization and improvement

Electronics Forum | Fri Feb 16 11:07:25 EST 2007 | stepheniii

I'm not sure if anyone mentioned the single most important factor. p.m.'s. If the nozzles are getting dirty and clogged it's not going to do a great job of picking parts up. Don't think in terms of variation. It's there it's unavoidable and undet

Conveyors and bar code

Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill

I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a


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