Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Thu May 18 15:47:18 EDT 2006 | slthomas
Don't really know if fixing the damage would even fix the board. The cut is deep, short, and narrow, like it was stabbed with an Exacto point. There is visible disruption to copper in the second layer but we can't tell if there is an open, a short, o
Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc
First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Mon Feb 23 13:12:55 EST 2004 | Mark
I have used MPM 3000 and Dek 265 Horizon. We always just fill them up with regular old alcohol. Cheapest and easiest way to maintain.
Electronics Forum | Wed Jul 25 09:21:44 EDT 2001 | Stefan Witte
Dave is right that this site has several leads on 0402 placements and tombstoning issues. However, I found a new method of determining the pick position. Remove a component and fill the cavity with silly putty. After attempted pick up you should see
Electronics Forum | Fri Dec 12 17:46:52 EST 1997 | Stefan Witte
Two pre-owned Siemens pick & place machines model MS102 for sale! The machines will be completely refurbished and calibrated. All feeder slots are filled with component feeders. I also offer machine installation, training and service. Asking price is
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
