Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424
I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of
Electronics Forum | Thu Feb 21 03:25:58 EST 2008 | jlawson
I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet in LF (sac305) soldering. We found that the solder tended to be attracted to the plating on the part and off the actual pad (silver Immersion). This c
Electronics Forum | Fri Mar 05 02:59:59 EST 2010 | grahamcooper22
Hi, Do you have a picture on one of these leads where the solder has covered the lead ? As this is a gull wing device I wouldn't expect solder to cover it. I expect to see a toe fillet / wetting around the sides of the lead and a heel fillet. If your
Electronics Forum | Tue Oct 05 12:29:28 EDT 2010 | mikesewell
It is possible to infer that the lead is lifted based on the toe fillet appearance, but it's not as reliable as say a laser or xray inspection. This is usually done by varying the light source location and or color and looking at the images resultin
Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Electronics Forum | Wed Jun 04 21:11:11 EDT 2014 | isd_jwendell
This style gave me grief as well. The problem is the way the part is manufactured leading to an unusual pad configuration. When the part is placed on the PCB there is no pad wrap under the part, the pad is 90 degrees to the board. The datasheet shows
Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf
Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
