Electronics Forum | Fri Oct 13 07:34:49 EDT 2000 | Wolfgang Busko
If it�s in reflow, do you see where the solder is going? If it�s in wavesoldering, how�s the orientation of the parts? Wolfgang
Electronics Forum | Fri Oct 13 15:26:20 EDT 2000 | Dave F
We periodically see chip caps with poor solderability. Often terminations are missing plating.
Electronics Forum | Tue Oct 17 18:36:49 EDT 2000 | Philip Reyes
Yeo, These are possible rootcause of that defect and you can evaluate. 1. Orientation of the capacitor, maybe the cap is located behind big component. 2. Reflow profile, check the profile on that side. 3. Yes, check also the mounting force. Philip
Electronics Forum | Thu Mar 22 16:06:22 EST 2001 | dblsixes
Our next plan of attack is to dog-bone the solder aperature. By reducing the width of the solder paste at the heel, we hope to slow the flow up the leg of the pin while the temperature of the pad catches up. We have boards that were HASL ...
Electronics Forum | Sat Mar 24 16:34:06 EST 2001 | Stefan
Can you increase the placement force on your P&P machine? It should squeeze the solder paste to all sides including the heel.
Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan
I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of
Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford
AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Thu Oct 31 09:28:15 EST 2002 | russ
Toe fillets are not required per IPC, you can actually have toe overhang. Russ
