Electronics Forum | Fri Oct 11 09:54:34 EDT 2002 | russ
For whatever its worth, IPC does not require a full fillet in this situation. If it has to be a complete fillet due to contractual agreements you may want to try and preheat the board first with hot air or something and then solder. Russ
Electronics Forum | Thu Mar 23 10:52:48 EST 2006 | Gilligan
Wave Master and MoonMan, sitting in a tree S-O-L-D-E-R-I-N-G First comes dross Then comes fillets Then comes Consulting about the no-lead stuff
Electronics Forum | Thu Apr 12 20:44:58 EDT 2007 | raychamp007
If the solder joint meeting 8.2.5.4, minimum side joint length(D) and also meeting 8.2.5.6, minimum heel fillet height (F) but the heel fillet NOT extend to the mid point of outside bend. It is acceptable?
Electronics Forum | Mon Dec 01 13:17:43 EST 2008 | realchunks
Jandon, what is wrong with the picture you posted? Looks good to me? The first pix Wewilldoit posted were kinda scetchy except for the one with the bent up lead. It's not the toe fillets people - it's the heel fillets you have to look at.
Electronics Forum | Mon May 17 22:46:02 EDT 2010 | qaace
IPC also states that side overhang on a gull wing of 50% is acceptable for Class 2. Does anyone know if that interprets to only one side having a fillet? Also with toe overhang acceptable, there need not be a toe fillet.
Electronics Forum | Wed Jul 17 11:57:38 EDT 2013 | proceng1
Everything in 7.4 shows the clinch and fillet on the other side, assuming the body is mounted on the Component side. In my case, the fillet will be on the body side.
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Wed Jul 06 14:36:05 EDT 2005 | Bob R.
The only way we can consistently get a toe fillet is to use a paste with an extremely active flux. We allow that paste on certain products, but discourage it's use because it's on the hairy edge of not meeting our lower limit in surface insulation r
Electronics Forum | Wed Jul 23 05:47:53 EDT 2003 | iman
Yo Thanks! right on the money pad, the pinhole occurs mainly in the (fillet's) top-surface central of the whole solder (fillet surface) area. Like you said, large surface area, lowest surface tension. that's a possible cause, that the potential voi
Electronics Forum | Fri Sep 09 07:55:08 EDT 2005 | davef
This pattern indicates flex cracking due to excessive bending of the board or fixture after soldering. Ceramic is strong in compression, but weak in tension. When bending causes damaged parts, look at: * Board flexes, ceramic is strong in compressio
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