Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Mon Jul 22 13:19:31 EDT 2019 | davef
While we're are it, here's a link to a recent FORUM thread that talk's about BTC standoff height: https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=21852&mc=9
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Tue Jan 29 17:11:32 EST 2019 | slthomas
Your product is Class 3, correct? Otherwise, a clearly wetted connection is all you need.
Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
