Electronics Forum: fillet height minimum lug (Page 1 of 1)

FLAT LUG LEADS (USBS & SOD123 DIODES) - TOE WETTING

Electronics Forum | Mon Jul 31 03:50:26 EDT 2023 | calebcsmt

Is below the correct interpretation of IPC 610/JSTD requirements for FLAT LUG LEADS (seen on USBs and Diodes mainly) For class 1 or 2, no toe wetting would be required as minimum side joint is only 'evident wetting' and no actual length or fillet he

Solder Fillet

Electronics Forum | Tue Jul 01 22:20:26 EDT 2008 | davef

Fillet Height [F]. Wetting is evident on the vertical surface of the termination as the minimum fillet height.

Heel bend wetting for Gull Wing lead

Electronics Forum | Thu Apr 12 20:44:58 EDT 2007 | raychamp007

If the solder joint meeting 8.2.5.4, minimum side joint length(D) and also meeting 8.2.5.6, minimum heel fillet height (F) but the heel fillet NOT extend to the mid point of outside bend. It is acceptable?

IPC pass/fail

Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter

> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.

double sided reflow criteria

Electronics Forum | Tue Feb 04 18:46:01 EST 2003 | slthomas

"Use the pad mating to lead wetting area." If I get your drift, we're talking about the minimum lead area (assuming the pad has an area that's at least as large as the lead) required to be wetted by IPC-610. Hmmmm...that would take some calculation

Pin Through-Paste with Lead-Free

Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef

We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi

Underfill Inspection Criteria

Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis

Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The

Underfill Inspection Criteria

Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW

Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image

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