Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Thu Jul 10 11:23:36 EDT 2003 | slthomas
I think the guys that write the checks are convinced that it's a service, not a problem. :P
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Thu Jul 10 10:34:15 EDT 2003 | davef
Don't forget that you owe me a garnet pyroxenite, if you go over there to fix this problem.
Electronics Forum | Thu Jul 10 11:49:26 EDT 2003 | davef
Dang!!!! ;P Hey, wait a minute!!! The BIG DOGS believe "it's a service, not a problem". Are you saying that they think that you're fortunate to get parts falling off of the boards? So there cracks are part of the value added? Whee!!
Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef
Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Wed Jul 09 09:27:02 EDT 2003 | MA/NY DDave
Hi Saw a Cross Section picture and thought of you You noted above that you couldn't find any pictures or descriptions of your problem in a few well known sources. It probably is not what you are experiencing yet a soldering defect called land lift
Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas
I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
