Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Mon Aug 18 10:42:04 EDT 2008 | floydf
We are in the process of preparing for a new board that requires paste in hole processing. The hole is a .020" via, and our customer wants it filled with solder, but not bulging past flush. For printers,we use a DEK 249 with a squeegee, and a DEK 260
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef
Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?
Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika
Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Electronics Forum | Thu Jan 06 09:03:57 EST 2005 | russ
It appears that this particular PCB supplier has a non-optimum HASL process along with other issues. It is much harder to completely remove the solder out of vias on thicker boards. Looks like more air pressure was needed to remove all of the exces
