Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.
Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
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