Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Wed Apr 11 14:05:30 EDT 2001 | davef
No, there's not a really great epoxy product for attaching thermocouples in reflow. Specifically, what's your problem? From Sanders Temprobe verbage ... Adhesives There are two general classes of material commonly used to adhesive bond thermoc
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Electronics Forum | Wed Dec 23 11:42:46 EST 1998 | Earl Moon
| | Folk's, | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, text
Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman
Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p
Electronics Forum | Mon Sep 20 11:50:26 EDT 1999 | Wolfgang Busko
| Hi all, | | As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? | | I won
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford
AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
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