Electronics Forum | Tue Jul 01 21:06:12 EDT 2003 | ramanandkini
My customer just assembles it to the car. We want to use the silica gel to avoid moisture since the assembled part (clock) reach him via ship after 50 days. The electronic circuit board has no conformal coatings at present. We are working on that. Ou
Electronics Forum | Sat Jun 28 22:52:34 EDT 2003 | ramanandkini
We have an Electromechanical assembly (clock) that has a step motor on the board. This electromechanical assembly is assembled in a screw less plastic moulded casing. The plastic casing is neither air tight nor water proof. The board is with SMOBC+ H
Electronics Forum | Wed Nov 19 18:43:04 EST 2014 | gregcr
Hi All, I've been in the CM world for a long time and it seems like there has been little change in the packaging techniques used at the end of the day. Assembled circuit boards in small/flex volume are bagged or bubble wrapped and boxed up to ship
Electronics Forum | Fri Sep 24 08:19:35 EDT 2004 | Rob
Hi FengAng, Sorry about the misunderstanding - last time I was out there all of the front end SMT equipment was very good, but the final assembly of the phones into cases was being undertaken by hand, whereas in Europe we were seeing a lot of automa
Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette
Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Wed Jul 21 10:11:57 EDT 1999 | Mark Quealy
| | Dear all | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | Our appliocation is Mainly fabrication of mother boards. | | Thanks | | | In theory, ICT is the classical answer (In-Circuit Test).
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
Electronics Forum | Sat Feb 23 13:36:44 EST 2008 | schorschimi
Manual THT assembly (10 to 300 boards, 20 to 300 THT components each)requires instructions for the semiskilled workers. These instructions should also be used for viual manual inspection and the final AQL. Which type of instruction is recommended? L
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
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