Electronics Forum | Wed Sep 10 15:31:11 EDT 2008 | gregoryyork
Should have sent them in for Xray/microsection Steve that sorts out the QA guys over here
Electronics Forum | Wed Sep 10 15:54:57 EDT 2008 | slthomas
"When we solving a problem we have to be absolutely sure it's really solved." Conversely, it's always good to return things back to the way they were when you conclude that THAT knob turn didn't solve the problem.
Electronics Forum | Wed Sep 10 16:09:45 EDT 2008 | vladig
To me it speaks about teh quality of the engineers. I[ve seen both types, though Vlad
Electronics Forum | Thu Sep 11 10:18:15 EDT 2008 | gregoryyork
Sorry all I know is that storing the paste Tip down the flux will run to the tip of the cartridge so will be runny initially then dry up as you use the cartridge. Unless the Rheopump mixes it before application
Electronics Forum | Thu Sep 11 10:25:51 EDT 2008 | rarnold
Flux is less dense than metal so it 'floats' to the back NOT the tip when the tubes are stored tip down.
Electronics Forum | Thu Sep 11 11:11:31 EDT 2008 | gregoryyork
Yes sorry you are right so you have answered your own question anyway. Dry to start runny at the end
Electronics Forum | Thu Sep 11 12:38:45 EDT 2008 | vladig
I'm curious how many knobs have left to be turn? :-) Isn't time an issue in a production environment? Vlad
Electronics Forum | Mon Sep 08 09:59:56 EDT 2008 | vladig
Here we go with another "solderability problem". How do you know the pads on the bare PCB are oxidized? Just based on its colour? If that is the root cause, then why ohter parts on the same board are fine? If you want to solve the problem, get it's
Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1
We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea
Electronics Forum | Sat Sep 06 03:48:29 EDT 2008 | rameshr
hai, we r using type 4 solder paste in our pcb assembly process - we are now facing the following problem. 1. two component pads soldering was seemed uncoalesced soldered joint except all the other components. 2. what will be the problem & solution f
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