Electronics Forum | Thu Nov 07 09:56:26 EST 2002 | bpan
Thanks for the ideas guys. My QC inspector can take a pick and move the back part of the lead....even though the front of the lead is soldered enough to hold. There is SOME NOT ALL areas where there is no solder on the curved portion of the lead.The
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Electronics Forum | Mon Aug 16 14:43:44 EDT 2010 | dan_ems
Hello, i don't know if is possible to dispense paste but for reduction of cost we use a diferent type of stencils, from aluminium of 0,2 mm, purchased from a typography of newspapers. Ofcourse the pcb for what we use this stencil are simple. But th
Electronics Forum | Mon Aug 16 20:50:05 EDT 2010 | adhesivedispenser
CiXi Tian Hao Electric Technic Co.,LTD manufactures adhesive dispensing equipment and may be able to offer assistance with your application. Check out our product information at http://dispensing-th.com. We manufacture dispensing equipment ranging fr
Electronics Forum | Sat Aug 21 02:27:21 EDT 2010 | isd_jwendell
The paste you dispense will not solder the same as the one you use with a stencil. The paste for the stencil will have a higher metal content. I was not working with dispensing as small as you are, but after evaluating the cost of the stencil vs. lon
Electronics Forum | Tue Dec 11 11:59:00 EST 2012 | sarason
The issue is surface tension around the connector. Your tip needs to have more surface tension than the pins of the connector as it forms a cluster when being soldered. When I used to solder superfine connectors with a metcal iron it had a horses hoa
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Dec 12 16:12:58 EST 2012 | tombstonesmt
Glad to hear we have more Jade users on the forum! What kind of flux footprint is your fluxer leaving on the board? You called it a "spray" fluxer.. We use the MIC fluxer that functions like a jet fluxer. Do you flux each individual lead or do a
