Electronics Forum: fine pitch parts (Page 2 of 227)

fillets on fine pitch parts/poor wetting

Electronics Forum | Wed Nov 06 16:31:59 EST 2002 | slthomas

I would also consider paste control (don't take it personally...I always have to get after people about this one), time on the stencil, time between print and reflow, solderability of the component leads, paste volume (that one really got us once....

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 09:08:57 EDT 2006 | Bubba

OK, part touching paste before reflow? Check part. Maybe bad plating. Check reflow profile by slowing conveyor.

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 18:32:51 EDT 2006 | vicknesh28

Yes the part is reworked. It solders when it's reworked.

Thermocouple attachment on fine pitch component.

Electronics Forum | Tue Apr 17 09:19:11 EDT 2001 | Terry Burnette

Dave, I use Dexter Hysol epoxy 9340 gray. It's a two part epoxy kit. Thermally conductive and electrically insulative. Cures in about 10 minutes at 100C. Terry

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 14:43:33 EDT 2006 | davef

Questions are: * So after you spot one of these leads sitting on a nice pillow of solder, what happens? * Do you rework the part? * Does it take solder? * What do you do to make it take solder, if it does take solder?

Non wetting on fine pitch product

Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba

Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl

Solder Paste and fine pitch components

Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno

Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar

Thermocouple attachment on fine pitch component.

Electronics Forum | Wed Apr 11 14:05:30 EDT 2001 | davef

No, there's not a really great epoxy product for attaching thermocouples in reflow. Specifically, what's your problem? From Sanders Temprobe verbage ... Adhesives There are two general classes of material commonly used to adhesive bond thermoc

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

fine pitch QFP

Electronics Forum | Sat Jun 18 00:35:15 EDT 2005 | mskler

Thanks to all. I am working on your suggetions will get back as the problem solved


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