Electronics Forum | Mon Oct 14 14:11:39 EDT 2013 | island2013
Yes, I agree with Evtimov. It's more about aperature reduction and type than it is the type of machine. Aspect and and Area Ratio are very important. Take a look at this page I found on the internet http://www.qualiecocircuits.co.nz/stencil-techno
Electronics Forum | Wed Oct 16 10:05:36 EDT 2013 | markhoch
I heard it works well on Chrome Rims for your car too. Swag, I'm not at all suggesting that your operators have discovered this and this is why you keep running out and have to keep ordering it :-p
Electronics Forum | Thu Oct 17 16:19:04 EDT 2013 | island2013
I've used the Nano Protek product in the past and it is fantastic, worth every penny for those small aperatures. It's just like a wax and yes it works great on rims ;)
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
Electronics Forum | Thu Oct 17 14:36:30 EDT 2013 | hegemon
Hey SWAG, any idea where that Nano Protek goes, that you have to replace it? (and I am not talking about polishing up wheels) Is it being scrubbed off of the stencil during the print process, and over time it must be replenished? Sorry a bit off top
Electronics Forum | Thu Oct 17 21:13:35 EDT 2013 | hegemon
But where does it go, that it needs to be refreshed or replenished on the stencil? Does that "just like wax" product wind up in my solder joints, no matter how small the percentage, and would it then qualify as a contaminant? I heard there are some (
Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox
Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Fri Sep 15 12:30:05 EDT 2006 | Steve
If the package is robust enough to handle surface mount followed by a pass through the wave soldering process, we have had excellent results populating the fine pitch parts with the P&P machine, reflow, then mask the solder joints prior to wave solde
Electronics Forum | Fri Jun 09 15:41:59 EDT 2006 | shawnvike
That is the problem I am having! Except with 3 separate manufacturers. To answer some of the other questions... Baking - diligence Stencil - as far as we can tell it is good Placement is good We are using Pb-free parts and solder, but I have see
