Electronics Forum | Mon Sep 25 17:06:36 EDT 2000 | JAX
LarryK, You might want to talk with: Fancort Industries, Booth #2630 31 Fairfield Place West Caldwell, NJ 07006 973-575-0610 www.fancort.com MLCS-1 Manual Lead Conditioning System. It is a bench top, hand operated machine to correct deformed lea
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Sep 30 14:06:04 EDT 2008 | realchunks
What pitch? You can go 5 mil or even 6 mil stencils depending on your screen printer. Also what do you consider "less solder"? What defect are you having. Remember on a QFP you use the heel filet to determine proper solder joint - not the toe.
Electronics Forum | Thu Sep 07 03:47:07 EDT 2006 | vicknesh28
I have been getting non wets on fine pitch QFP packages on random leads during reflow process. I noticed that every time there is some flux residue left between the non-wet lead and the solder pad. No residue was not observed on the rest of the good
Electronics Forum | Mon Oct 02 16:31:17 EDT 2000 | Larry
I have seen people take old stencils and cut out land patterns, place the component over the land pattern and use a orange stick to move the leads back into place.
Electronics Forum | Wed Apr 11 11:40:44 EDT 2001 | gcs
High temp solder is the best, but your profiler manufacturer will have some type of adhesive. I know KIC does.
Electronics Forum | Wed Apr 11 17:15:54 EDT 2001 | davef
More often than not lately, we use Al tape [like Brian W mentioned in a recent thread].
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
