Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Fri Sep 08 10:23:38 EDT 2006 | slthomas
By profile (profile has not been changed) are you referring to the oven zone settings or the actual charted profile of a trip through the oven as recorded by a thermal profiler? Some ovens will continue to function without warning as long as temps
Electronics Forum | Fri Dec 07 13:31:09 EST 2012 | kenkay
We had a similar issue and it was fixed by trimming the connector so there was barely enough lead protrusion through the board to show a discernible lead. We had to get a special plate and small machine to cut the connectors, but we haven’t had a bri
Electronics Forum | Wed Dec 19 10:33:58 EST 2012 | emeto
I had a connector like this and here is my recommendation: 1. Flux type(I like better alchohol based flux than water based) 2. Try higher soldering speed(when I say higher I mean several times higher) Goodf Luuck!
Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon
Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Dec 12 16:12:58 EST 2012 | tombstonesmt
Glad to hear we have more Jade users on the forum! What kind of flux footprint is your fluxer leaving on the board? You called it a "spray" fluxer.. We use the MIC fluxer that functions like a jet fluxer. Do you flux each individual lead or do a
Electronics Forum | Tue Dec 21 16:47:15 EST 1999 | GERARDIN
Hello Pascal As mentioned by Wolfgang the key issue is the printing process capability. For a thick copper level 90�m we noticed that the pad reduction can be greater than 20% depending on supplier sources. Typicaly for a cad Width = 0.4 we can
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
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