Electronics Forum | Mon Jul 21 11:10:29 EDT 2008 | davef
We blab about component baking all the time. Search the fine SMTnet Archives for more, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=52970 Here is good background materal on MSD: http://www.smta.org/msd/msd.cfm
Electronics Forum | Wed Apr 04 17:40:39 EDT 2007 | davef
Rob: How do you rework blow-holes and pin-holes? PTH plating thickness SB 1 thou or greater. Epoxy is hydroscopic. So, you should control the environment and/or bake the moisture from the boards before soldering. Search the fine SMTnet Archives f
Electronics Forum | Mon Jul 19 21:33:26 EDT 2004 | davef
Are you talking about small 'volcanos' that burst through PTH solder connections? If so, you have moisture outgassing through the PTH barrels: * Plating on the hole of your bare board is too thin. It should be greater than 1 thou [25um]. * Your bak
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
Electronics Forum | Tue Jul 06 07:49:08 EDT 2004 | davef
Q1)What is the MSD level for PCB? A1) There is none Q2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assem
Electronics Forum | Sun Jan 19 10:45:04 EST 2003 | davef
For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. [Search for other bake recipes in the fine SMTnet Archives.] Alot of the determination of baking time is a function of: * Amount of moisture absorbed. * Amount of moisture you need to r
Electronics Forum | Thu Apr 05 08:04:40 EDT 2007 | davef
On finding baking recipes in the fine SMTnet Archive, your problem is not in the flex portion. It's in the rigid [FR4] portion. On baking advice from experts look here: http://www.circuitnet.com/experts/EQ10120.shtml Finally, on reworking your ou
Electronics Forum | Wed Aug 07 08:46:38 EDT 2002 | davef
The time and temperature required for baking moisture from your boards varies according to the conflicting desires to: * Remove enough entrapped moisture. * Desire to retain solderability of solderable surfaces. Search the fine SMTnet archives for s
Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Wed Aug 07 09:05:11 EDT 2002 | davef
N2 PPM vs %RH? With a firm grasp of the obvious, reflow oven manufacturers rig N2 ovens differently than non-N2 ovens. The N2 displaces O2. Usually N2 oven monitor something or other to give an indication of N2 ppm. %RH really isn't part of the eq
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