Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Thu Jan 20 10:47:57 EST 2000 | Chad Notebaert
There are several ways to do this, if you are doing large volumes the best way is to use Titanium Finger Masks. You can have them custum made or if you are lucky one of the standard sizes will fit. They slide over the fingers to protect them through
Electronics Forum | Wed Jun 25 08:50:54 EDT 2003 | russ
I believe that Fancort makes some finger protectors that are made of Metal (Aluminum, titanium, etc...) I don't know how well these would process through placement equipment however due to their thickness. Could you clean the Kapton residue off just
Electronics Forum | Tue Jan 24 20:00:39 EST 2012 | kahrpr
If you failed math like I did. A 0.005 inch stencil would work fine for those parts. Most stencils are 0.004in for fine pitch 1005s 201s. 0.005in is probably the most common generic stencil. 0.006in generally is if you need extra solder for big parts
Electronics Forum | Fri Feb 11 14:32:44 EST 2000 | Ashok Dhawan
I am looking for a Masking tape for Gold fingers on a PCB . It should not leave any residue on reflow soldering ( 220 deg c). Currently, I am using Kapton tape with Silicon adhesive. It is leaving minute quantities of residue? The fingers are al
Electronics Forum | Fri Jun 09 08:20:56 EDT 2006 | kehoem@bellsouth.net
We have a board calling out for 50 micro-inches of nickel over 30 micro-inches of gold. This is a solid gold board on Rogers material. ENIG cannot be deposited that thick right? Electroplated gold (we thought) was usually 35-50 micro-inches and was
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
