Electronics Forum | Thu Sep 19 16:46:45 EDT 2002 | dragonslayr
There are never stupid questions - only stupid answers. More detail is needed to be helpful for your answer. Yes, there are ways it can be done - depending on the application, practicality and expense. What is it that you are trying to power with 1
Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Wed Oct 09 16:59:35 EDT 2002 | davef
Russ, as I told Eric the other day ... The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This prov
Electronics Forum | Fri Oct 11 03:17:52 EDT 2002 | Adam
Guys I was wondering if anybody has some useful advice with regards to achieving 100% solder penetration on one pin of a through hole device which I believe is attached to a ground plane. All other pins on the through hole device are fine, Just this
Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie
Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
Electronics Forum | Mon Dec 09 08:30:13 EST 2002 | MA/NY DDave
Hi Well you already got good answers with some diversity, yet from what I read they are giving you the answers for Assembled PWBs, i.e. post solder or PWAs. I don't remember ever doing this for raw boards. For most of the current pwb finishes it se
Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen
We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i
Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
Electronics Forum | Tue Jan 21 11:11:07 EST 2003 | slthomas
OK, so the issue is with the variability of the alloys on the soldering surfaces and the subsequent variability of reflow temps. Sounds reasonable (actually obvious, now that I think about it), especially on the component side. We only use HASL fin
