Electronics Forum | Mon May 14 17:11:48 EDT 2007 | russ
I am a CM, We do not use White tin either, we have had numerous solderability issues with this finish, We all agree when done correctly it is good, however I am at about 10% correct and 90% have issues. We currently use Immersion silver and Gold f
Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Thu Apr 19 08:50:38 EDT 2007 | rgduval
Welcome to RoHS. Or, at least, to the version of RoHS that I've had to deal with since I started with my current company. Blowholes and pinholes seem to be common in PB-free manufacturing. At least, they have for me here. I also note that IPC has
Electronics Forum | Fri Sep 12 04:21:54 EDT 2008 | gsala
Had same problem with SOT23 (two different PNs and Suplliers) problem was random (AVG 0,15%). Parts are RoHS but soldered by SnPb, Lead frame Plating (e3)according to IPC-J-STD609 it means Sn pure (check the label on reel), additional info, it is S
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Mon Sep 11 08:52:12 EDT 2006 | Amol Kane
lead-free processes involve higher temperatures. if you run this PCB thru the reflow oven, the worst possible scenario is that the board may melt and deform. even if it doesnt, it may delam internally (and or the bare board reliability might be compr
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell
If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
