Electronics Forum | Fri Sep 08 11:50:39 EDT 2006 | Rob
SN100C is designed not to corrode your pot, and can be used on standard solderpots (after a proper clean out), whereas SACX is still corrosive and if the coating is compromised then could cause problems. Get it in writing from the supplier that the
Electronics Forum | Fri Sep 08 09:10:32 EDT 2006 | Claude_Couture
Hello all, The situation: We recently had 2 brand new solder wave installed, one after the other. On the first one, the "protective coating" on the solder pot started to flake off 1 day after start-up. The tech who did the installation witnessed it a
Electronics Forum | Fri Sep 08 11:38:42 EDT 2006 | GS
Last april,I have seen same behavior on a pot using SACX. Phenomena happened just few days after start up of a brand new solder wave. I know they have got the pot replaced but I do not know what about the new pot if had same problem. I know they mad
Electronics Forum | Fri Jun 06 09:20:50 EDT 2014 | isd_jwendell
Can you see the flaking right out of the oven?
Electronics Forum | Mon May 11 18:30:10 EDT 2009 | boardhouse
Hi Milas, Here is a link to an artical on the subject. http://pcdandf.com/cms/content/view/4784/95/ The big difference in the to is that ENIG is self limiting where as electroplating is not. All product manufactured with either finish goes throug
Electronics Forum | Wed Jan 11 14:38:37 EST 2006 | cg
We have recently started using lead free solder on our wave. The dross accumulates rather quickly. The dross flakes (tin oxide?) are light enough to sometimes fall or float into the main wave. What kind of quality concerns are there if the dross is m
Electronics Forum | Mon May 11 11:05:08 EDT 2009 | milas
Hi 1. Does anyone know what the pros and cons are of ENIG vs Electroplating ? 2. Is there a likelyhood that in either of these processes the gold can flake off after a period of time ? Thanks in advance Milas
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
Electronics Forum | Fri Jul 24 16:39:16 EDT 2015 | cnotebaert
have done it in the past, used silicon as it will flex,, however its not the most robust material! tends to peel/flake off.
Electronics Forum | Thu Jun 01 10:48:21 EDT 2000 | Jeremy
I am having a problem with the green solder mask flaking off exposing bare copper. The mask was defective from the board manufacturer. My problem is the boards are already assembled and we are just finding the problem. Is there a standard that cover
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