Electronics Forum | Mon Jul 26 06:41:37 EDT 2004 | cyber_wolf
Grant, I also have to say that the microwave thing is the coolest thing I have heard lately.Hahahahaha!! ! Here in the U.S. we have these comical Foster's beer comercials that are really really funny. I kept having flashes of those when I read this
Electronics Forum | Mon Sep 13 10:39:50 EDT 2004 | Marie
Suggest looking at the packaging,is it sufficient to prevent damage to the QFP?. What way are these components stored when received?.Are the reels stored in boxes or racks?.Storage in boxes may cause damage from stacking the reels on top of each oth
Electronics Forum | Wed Dec 01 16:06:55 EST 2004 | carln
Hello Brent, We switched to Smart Sonic's 440-R SMT Detergent and use less than 1 gallon every 4 - 6 weeks! Plus, you would eliminate the low flash point hazard and VOCs. Smart Sonic is at http://www.smartsonic.com Regards, Carl
Electronics Forum | Fri May 27 13:01:05 EDT 2005 | c111
Well if I thought using wood tools was a good idea I would not have posted the question. Since the flash point of paper is 451F I would assum wood would be close? I guess I should have asked does anyone know of any tools kits or come up with there ow
Electronics Forum | Mon Aug 22 09:48:35 EDT 2005 | PWH
Post a simple CAD picture of a BGA or IC on the door of the machine near where it gets loaded. This has helped us. Flash IC's can also be difficult as you can't always put pin one near front, left of tray slot. So... we always say pin one left no
Electronics Forum | Fri Dec 09 08:53:12 EST 2005 | russ
We used flash gold once by mistake and we did pay for it. A very high fallout of BGAs and some of the leaded devices for latent failures from fractured solder joints. I do not know how the other types of components faired in this process but I woul
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Thu Mar 30 08:48:37 EST 2006 | russ
So you have solder balls at the outer edge of the part right where the pad goes underneath? If so you just have too much solder but I wouldn't worry about them. the solder usually does not wet to the edges of these parts because of the exposed copp
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Tue Jan 23 23:28:54 EST 2007 | jovial_guy23
If you have flux deposits on the cooling plates, try out Zestron's VIGON RC101...It is an extremely good product especially for reflow ovens and wave solder systems. Check it out...Minimal maintenance water based chemistry with no flash point...Much
