Electronics Forum | Thu Nov 19 06:33:45 EST 1998 | Des
I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the we
Electronics Forum | Thu Nov 19 11:59:58 EST 1998 | Dave F
| I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the
Electronics Forum | Mon May 20 13:48:43 EDT 2002 | sbuckley
What is the recommended prep for a through-hole glass pack diode? Should a stand-off be used or can it lay flat on surface of the pcb?
Electronics Forum | Fri Mar 23 07:39:34 EDT 2007 | namruht
I have tried to teach the part a couple of different ways. I have the component taught as a Quad Flat Pack and I am ignoring two of the sides. This has provided better results but still not consistent.
Electronics Forum | Tue Aug 10 06:58:48 EDT 2004 | dka123
dear all, kindly guide me for the use of space electronics hardware assembky of PQFPs and Cqfps, how to form the flat pack leads, bend for 240 pins of 20 mil pitch and what are the Mil standards for them.how to cut the lead guards.can we use FP5 elit
Electronics Forum | Tue Oct 29 14:24:24 EST 2002 | genny
SOP small outline package SOIC small outline integrated circuit TSOP thin SOP TSSOP thin shrink SOP PQFP plastic quad flat pack (also CQFP is ceramic QFP) LQFP low profile QFP VQFP I don't know QSOP a guess is 'quad small outline pkg'
Electronics Forum | Fri Jul 18 07:14:10 EDT 2003 | davef
BGA - Ball grid array QFP - Quad flat pack As a bonus, look here to learn more SMT terms and definitions http://www.smtnet.com/library/index.cfm?fuseaction=content_terms1 There are other listings of definitions and terms in the SMTnet Library. Lo
Electronics Forum | Tue Aug 10 15:07:41 EDT 2004 | jbabson1
This could also be caused by a bad PD. What vision are you using for the Resistor Networks? I am assuming the you are talking about small flat packs about 3.3mm x 1.6mm? I use vision type 12 and just use the body size. (wide view). And 100% cam speed
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
