Electronics Forum | Mon Apr 23 11:31:23 EDT 2001 | Cal
You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample b
Electronics Forum | Tue Aug 22 16:13:08 EDT 2000 | Dr. Ning-Cheng Lee
FR-4 will be OK for small products such as cellular phones. Here the temperature gradient across the board may be 3-4C only, and the board temperature can be well controlled. At temperature above around 245C, the discoloration and delamination may be
Electronics Forum | Thu Jun 07 07:11:41 EDT 2001 | stefwitt
8" ). For calculation of the theta angle, the global fiducials should be placed over the diagonal. Component recognition can be improved if your vision system has different light zones. The steep light should be turned off and the flat light turned
Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Fri Aug 03 16:46:59 EDT 2001 | davef
It's OK to have a thin film or haze of paste left on the stencil. Printing nice bricks of paste is the important thing. Assuming you know these things, so tell us more about your situation. PRINT QUALITY: What do your paste deposits look like?
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Tue Feb 01 21:53:06 EST 2000 | Dave F
Emmanuel: You have choices to prevent the solder paste from flowing to the second side during reflow: 1 Have your board fabricator plug the vias. 2 Put a temporary solder mask on the secondary side vias. 3 Have your designer relay-out the vias unde
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Thu Mar 18 10:09:57 EST 1999 | Stefan Witte
| My engineering Dept. has informed me that they want | to start using pins, on an aluminum substrate in the | smt process. Pins are interconnect for daughter bds. | Dia. of pins 0.020" 0.040" 0.080" flat bottoms | 1) Does any one know how to
