Electronics Forum: flats (Page 70 of 80)

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 14:30:42 EDT 1999 | Deon Nungaray

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: uBGA's

Electronics Forum | Fri May 14 17:06:18 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: uBGA's

Electronics Forum | Fri May 14 17:06:29 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: Wavesolder solder balls

Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK

In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Re: Need info. on vib times for Siplace 80f4 Users

Electronics Forum | Mon Sep 14 21:40:25 EDT 1998 | Stefan W.

Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for an

Re: Need info. on vib times for Siplace 80f4 Users

Electronics Forum | Tue Sep 15 14:12:36 EDT 1998 | Justin Medernach

| Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. | However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for

Re: Need advice on fixturing a smt LED board

Electronics Forum | Fri Sep 04 09:33:40 EDT 1998 | Stefan W.

| I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior fo

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis

Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind


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