Electronics Forum | Wed Dec 09 19:21:13 EST 1998 | Bill Schreiber
Dave, Be careful if you plan to clean misprinted PCBs in a spray type batch cleaner. There is an article written by Dick Clouthier of AMTX Stencils regarding batch cleaners and their use for cleaning misprints. He describes it as a "solder ball nig
Electronics Forum | Wed Apr 04 14:29:16 EDT 2007 | rgduval
Anyone have experience wave soldering rigid flex assemblies? I've just picked up a new job from a customer; it's a rebuild for the company, but new to me. The customer had previously taken their business elsewhere due to delamination problems with
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Feb 10 02:14:39 EST 2009 | emmanueldavid
Smartasp, Seems this issue is certainly making a long thread ! As far as our Experience is concerned on Reflow Soldering, particular parts must have failed in LSLs [Lower Specification Limit] and have not withstand well under USLs [Upper Specificat
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Tue Aug 15 07:02:13 EDT 2000 | George Verboven
We are assembling SMD-Leds (Chip LED cl-220yg-c-ts)on flex foil with Electrical conductive glue (Matthey A1401). When we investigated these foils we found cracks between the conductive adhesive and round the edge of the Chip-leds. This cracks cause f
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval
Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w
Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon
Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for
Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef
We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than
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