Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip
Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you
Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler
We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.
Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca
Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca
Electronics Forum | Thu Jun 04 14:30:13 EDT 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
Electronics Forum | Thu Feb 12 17:21:07 EST 1998 | Justin Medernach
| I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards | before assembly. | + Is it necessary to wash and bake PCB�s before assembly? | + If any, what is the reason for wash and bake of PCB�s? | + If any, wh
Electronics Forum | Wed May 14 13:31:22 EDT 2014 | taiji
You should look in to this document: IPC/JEDEC-9704A Printed Circuit Assembly Strain Gage Test Guideline Regards
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Fri Oct 01 09:32:25 EDT 2010 | mazjal7
Rob, thank you for input. I notice you mention a baking process for the flex circuits, this is our first time with flex assembly, do the flex circuits need to be baked prior SMT, Moisture? Thanks, David
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