Electronics Forum: flex 2010 c (Page 1 of 26)

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Dec 22 21:14:53 EST 2004 | davef

IPC-FA-251 recommends 121*C for 30-60 minutes for 1 and 2 flex layer circuits. A rigid flex can take easily an hour per layer depending on the construction.

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 09:32:25 EDT 2010 | mazjal7

Rob, thank you for input. I notice you mention a baking process for the flex circuits, this is our first time with flex assembly, do the flex circuits need to be baked prior SMT, Moisture? Thanks, David

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Wed Sep 29 11:25:49 EDT 2010 | mazjal7

Hi, We are placing a Surface Mount connector on a flex circuit, we are planing on using SMT carriers to support the flex through the SMT process. Underneath the connector a stiffener needs to be adhere, I'm not sure if we should have the flex manu

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 10:05:29 EDT 2010 | rrpowers

You don't necessarily have to bake the flex circuits, but you do have to worry about moisture. Polyimide is very hydroscopic, and depending on the flex construction, any moisture in the product can lead to delamination. Adhesive based flex circuits

Flexible PCB

Electronics Forum | Fri Jan 29 10:03:25 EST 2010 | jamyboy

The SMT MFG Process for Flex circuits is relatively the same as traditional SMT process, the key is your PCB supplier. The good flex circuit shops will supply the circuits in a rigid carrier or if Rigid/Flex the supplier will create a support structu

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 08:27:28 EDT 2005 | siverts

The 7 spindle Flex jet head, can only pick max 7 comps. from the GSM base machine in a single operation, not from the shuttle. The Flex jet head is faster in z-axis and will also use the OTHC (On The Head Camera) to inspect most of Your smaller comps

Flex Circuits - Bend proximity spec

Electronics Forum | Wed Aug 04 17:42:11 EDT 2010 | davef

IPC-2223, Sectional Design Standard for Flexible Printed Boards

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Wed Sep 29 14:24:34 EDT 2010 | mazjal7

SWAG, Thank you for your suggestion, you brought a very good point.

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Wed Sep 29 12:17:03 EDT 2010 | swag

You might try assembly carrier tape such as Tacsil on your fixtures. Beware - arrays are very diffult to run in SMT flex unless you have no fine pitch.

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 09:47:36 EDT 2010 | noid

Yes, they should be baked prior. We pre-bake all polyimide fabs, flex or not. They are prone to delam.

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