Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Sat Jul 03 11:20:08 EDT 2004 | KEN
....not unique. But tough as hell! I build flex assemblies for a major P&P equipment manufacturer. Some are pure flex, most are ridgid flex. And of course, why put fiducials on the boards to help the process (why God, why me?) We use pallets and
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Mon Apr 19 15:27:05 EDT 2004 | pjc
The MicroFlex is not really new. Its the UltraPrint 100 re-engineered and improved. UltraPrint 100 / SMTech 100 has been around for many years. I don't believe the DEK 248 offers a Stencil Wiper option. I worked on MicroFlex machines. Vision system i
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad
One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,
Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef
Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t
Electronics Forum | Fri Aug 03 12:13:59 EDT 2001 | hinerman
T.A. board lok is fixed tooling. I have not used it, and therefore cannot comment on it. Their website describes it in detail for those interested. -The Grid-Lok system is completely pnuematic -Each pin locks individually via mechanical lock -Each
Electronics Forum | Tue Jul 15 18:44:20 EDT 2003 | davef
Sam says, �The only question remaining to me is that why the failure happened after 48 hours instead of immediate failure after soldering.� Let�s recap: * Had good-looking solder flow. * Passed the initial electrical test. * Failed the later electri
winsouce.jpg)
