Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven
For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php
Electronics Forum | Tue Apr 18 16:30:17 EDT 2006 | ratsalad
At my previous employer we ran HSP - GSM lines. Some sites used CIMBridge, others Unicam. We all used UCT52, not USOS, for the HSPs. At that time we had 4796's, 4791's, and USOS 4.X on our GSMs.
Electronics Forum | Thu Nov 15 12:11:40 EST 2007 | George
I use Pentagon EMS (503) 924-2747 with Chad Haima. Note: I do not get a penny for referals. I just like the service, super fast, high quality and excellent customer service. I have worked with them for about 4 years. Thanks, George
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Wed Oct 10 16:50:44 EDT 2001 | jeff
The "UP100 " is currently built by Speedline. However only the models UP100S (No Vision and manual adjust table ) and the UP 100MV (Vision and manual adjust table). These are batch printers not in-line. The IS model has been out of production for ab
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert
I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
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