Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Mon Jan 22 12:25:03 EST 2001 | dbonilla
Hi: I am looking for companies or consultants that can assists Manufacturing Technology Services ( Technology Alliance Division) to grow in advanced technology processes like BGA, Flip Chip, flex circuits, COB and others. I wish to know availability
Electronics Forum | Wed Jun 11 11:40:12 EDT 2014 | rgduval
As has been mentioned, it's likely that the component is moving in the tape, and flipping over. It is not likely that the pick/place operation is causing this. What I haven't seen mentioned is that there is an acceptability criteria in IPC for inve
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Thu Jun 26 07:20:09 EDT 2003 | emeto
Hello, What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject
