Electronics Forum | Mon Feb 08 17:11:04 EST 1999 | chris arnold
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. Earl, Pallets can be extremely u
Electronics Forum | Fri Sep 07 14:09:57 EDT 2001 | aqueous
Hi Carol, Pressure requirements have changed over the past few years. In the recent past, aqueous cleaning systems relied on high flow, low pressure �flooding� techniques. 20 � 30 PSI pumped through large orifice nozzles. With ever increasing boa
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Thu Oct 11 09:01:04 EDT 2007 | actech
Jon, Thank you for your input, I think you may be correct in that the Brd./Comp. of Fid data may not be correct any more. The unit was caught up in a flash flood just high enough in our facility to get the processor board. After cleaning and drying a
Electronics Forum | Wed Oct 17 09:19:23 EDT 2007 | actech
This box has the I/O card mounted sideways under it's own cover on the side of the main box. The CPU card is the bottom card. The Two driver cards X/Y and R/Z are side by side and mount to a steel base pannel with there relays at the back. but even i
Electronics Forum | Mon Jul 09 18:11:20 EDT 2012 | rsikora
Your selection of pads to use as Fids will be critical. In your pictures of the QFN component, the pcb pads are primarily non-solder mask defined, but on 3 sides of the QFN the corner pads become solder mask defined due to the copper ground flood.
Electronics Forum | Tue May 11 15:50:25 EDT 1999 | Russell Bartley
| | | | What is a Quad 100 with vision and glue dispenser worth these days? | | | | | | | JJ: It's similar, but not the same ... A friend bought a Quad 100, vision, couple of 8mm feeders, and 13 vib bases w/platforms for $5k last month. I told him
Electronics Forum | Tue Jan 12 17:51:41 EST 1999 | Tom Gervascio
I've been using selective soldering process for about 18 months. The major problem concerns tight spacing- the distance between the SMT pads to be masked and the thru hole leads to be wave soldered should be no less than 0.150 inches. Keep the wall
Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley
| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati
