Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F
Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin
Electronics Forum | Fri Feb 22 13:19:54 EST 2013 | caurbach
Our new Soltec Delta 3 has this feature (they call it mainwave pushup) where you can add up to 60 rpm to the pump after the leading edge passes over the wave. Unfortunately, our old Delta Wave doesn't have this feature. Ideally we'd like to set it
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
Electronics Forum | Sat Oct 30 16:53:19 EDT 1999 | jason
David I have recently taken the IPC-A-610B instructors course and according to the teacher the revised addtion is suppose to be 50 percent fill in plated thru holes
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Sun Oct 31 08:27:09 EST 1999 | Dave F
David: I think it's great that you are getting that much barrel fill with STEEL leaded components!!! So, what kind of steel are the leads are made from? How much corrosion is on the leads? Frankly, I don't believe that the leads are made of steel
Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
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